We’re excited to remind you that the event is just around the corner. There is still time to register and finalize your travel arrangements.
Grundbesitz Hellerau
Moritzburger Weg 67
01109 Dresden, Germany
The event will follow our familiar two-half-day format.
We look forward to your valuable contributions and to welcoming you at the workshop.
Please take a first look at our preliminary agenda, which is still subject to change.
|
TIME |
SPEAKER |
COMPANY |
TITLE |
|
13:00 |
Workshop Team |
Fujifilm |
Introduction |
|
SESSION 1: Think Inside, Outside and I-LINE the Box Chaired by Eva-Maria Hof (Brewer Science) |
|||
|
13:15 |
Michael Sternad / Philipp Horn |
Infineon |
Intensity-time dependent exposure effects on Durimide 7520 |
|
13:40 |
Pierre Sixt |
CEA-Leti |
Comparison between LTC polyimide versions |
|
14:05 |
Felix Buchta |
Infineon |
The Odyssey - Qualifying a Photoresist in High- Volume Manufacturing |
|
14:30 |
Break |
||
|
SESSION 2: Throughput, Throughput, Throughput Chaired by Jean-Luc Peyre (TEL) |
|||
|
15:00 |
Yvonne Bergmann |
Bosch |
Smart Maintenance for Uptime Improvement of Clustered Lithography Tools |
|
15:25 |
Stewart Robertson |
KLA |
PROLITH: Solving high volume fab issues using rigorous physical lithography simulation |
|
15:50 |
Kimberly Van Acker |
FFEM |
Logistic efforts on urgent orders |
|
16:15 |
Hands-on with Geert |
||
|
19:00 |
Dinner & Networking |
||
|
TIME |
SPEAKER |
COMPANY |
TITLE |
|
09:00 |
Workshop Team |
Fujifilm |
Introduction |
|
SESSION 3: Breaking Through ADVANCED RESISTance Chaired by Martin Mazur |
|||
|
09:05 |
Danilo De Simone |
IMEC |
Advances in PFAS-Free Lithographic Materials at imec |
|
09:30 |
Nishiki Fujimaki |
FFEM |
Challenges and progress of PFAS alternatives for ArF resist |
|
09:55 |
Carolina Morgado |
Brewer Science |
Thick transparent substrates: A Novel Application for KrF Multilayer |
|
10:20 |
Break |
||
|
SESSION 4: Packed with Potential Chaired by Tetyana Shapoval (KLA) |
|||
|
10:50 |
Marcus Wöhrmann |
Fraunhofer IZM |
Thin-Film Polymers for Advanced Packaging: Enabling Multi-Layer Routing and Polymer Hybrid Bonding. |
|
11:20 |
Jean-Luc Peyre |
TEL |
Coater and Developer for Advanced Packaging |
|
11:45 |
Yohsuke Watanabe |
FFEM |
Wave Control Material Introduction |
|
Closing remarks |
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Please find a few nice memory shots from the workshop in 2025 here below.
Get ready for the hands-on in 2026!
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