We were overwhelmed by your energizing and joyful contributions throughout the whole workshop! We would like to thank every attendee for making this day such a special event. The preparations for next year's workshop have already started and we look forward to welcoming you there. We plan to move back to our two half-day format.
Thu. 21 / Fr. 22 September 2023
Grundbesitz Hellerau
Moritzburger Weg 67
01109 Dresden, Germany
To access the presentations from 2022 please login with the provided password:
Please find a few nice memory shots from the workshop in 2022 here below.
Get ready for the hands-on in 2023!
|
TIME |
SPEAKER |
COMPANY |
TITLE |
|
13:00 |
FUJIFILM Workshop Team |
FUJIFILM Electronic Materials |
Introduction |
|
SESSION 1 - Chaired by Christoph Hohle (Fraunhofer IPMS) |
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|
13:05 |
Michael Steiniger |
Vishay Itzehoe |
LTC 9320: Process Setup and Optimization |
|
13:25 |
Niels Van Herck |
FUJIFILM Electronic Materials |
Enabling Polymers for Improved Resolution |
|
13:45 |
Ksenija Varga |
EV Group Europe |
The Future of Lithography for Advanced Packaging is Digital |
|
14:00 |
Audrey Berthoud |
STMicroelectronics, Grenoble |
New FUJIFILM resists qualification for smaller colored pixel RGB. |
|
14:15 |
Hirotaka Takishita |
FUJIFILM Electronic Materials |
New Low-Reflectivity Black Material With High Optical Density |
|
14:35 |
Break |
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|
SESSION 2 - Chaired by Sven Muehle (Globalfoundries) |
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|
15:00 |
Valentina Dall'Asta |
STMicroelectronics, Agrate |
Post-etch aluminum corrosions: the insertion of a water-stopping layer at lithographic step protects metal from etch-induced corrosions |
|
15:20 |
Douglas Guerrero |
Brewer Science |
Resist and Underlayer Roadmap for EUV Lithography |
|
15:45 |
Danilo De Simone |
imec |
A Lithographic and Etching Study on EUV Contact Hole Patterning for Stochastic Process Mitigation Towards Advanced Device Scaling |
|
16:10 |
Closure Remarks |
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|
Hands-On with Geert |
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|
Dinner & Networking |
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